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World's New Largest Wind Farm Could Power 13 Million HomesPosted by BeauHD on Saturday October 29, 2022 @06:00AM from the what-to-expect dept.China plans to break its own record for the world's largest wind farm by constructing a new one before 2025 that could power more than 13 million homes. Interesting Engineering reports:CitarThe 14th five-year plan for Chaozhou, China's Guangdong province, was released last week, outlining the city's ambitious plans for a 43.3 gigawatt (GW) project in the Taiwan Strait. Work on the project will begin "before 2025." It will surpass the largest wind farm in the world once it is finished, according to Guangdong province officials. The 10-kilometer-long farm, which will have thousands of strong wind turbines, will operate between 75 and 185 kilometers (47 and 115 miles) offshore. And because of the region's distinctive topographical features and windy location, these turbines will be able to run between 43 percent to 49 percent of the time, meaning 3,800 to 4,300 hours each year.A gigawatt is one billion watts, and 3 million solar panels are required to produce one gigawatt of power. 100 million LEDs or 300,000 typical European homes may each be powered by one gigawatt. The facility's 43.3 GW of power-generating capacity could supply electricity to 13 million households, which is equal to 4.3 billion LED lights, as per Euronews. The Jiuquan Wind Power base in China, a huge facility with a 20 gigawatt capacity, presently holds the distinction of being the world's largest wind farm.
The 14th five-year plan for Chaozhou, China's Guangdong province, was released last week, outlining the city's ambitious plans for a 43.3 gigawatt (GW) project in the Taiwan Strait. Work on the project will begin "before 2025." It will surpass the largest wind farm in the world once it is finished, according to Guangdong province officials. The 10-kilometer-long farm, which will have thousands of strong wind turbines, will operate between 75 and 185 kilometers (47 and 115 miles) offshore. And because of the region's distinctive topographical features and windy location, these turbines will be able to run between 43 percent to 49 percent of the time, meaning 3,800 to 4,300 hours each year.A gigawatt is one billion watts, and 3 million solar panels are required to produce one gigawatt of power. 100 million LEDs or 300,000 typical European homes may each be powered by one gigawatt. The facility's 43.3 GW of power-generating capacity could supply electricity to 13 million households, which is equal to 4.3 billion LED lights, as per Euronews. The Jiuquan Wind Power base in China, a huge facility with a 20 gigawatt capacity, presently holds the distinction of being the world's largest wind farm.
TSMC Wants To Unleash a Flood of Chiplet Designs With 3DFabric AlliancePosted by BeauHD on Saturday October 29, 2022 @09:00AM from the new-era-of-chip-design dept.An anonymous reader quotes a report from The Register:CitarAMD turned to advanced packaging to create chiplet designs and become a formidable CPU player again. Apple used the tech to beef up the power of its M1 Ultra chip. And Intel is pinning its future success on 2D and 3D multi-die packaging technologies as part of its ambitious comeback plan. Now TSMC, the world's largest contract chipmaker, wants to make chiplet-based products easier and faster to manufacture using its growing toolbox of advanced packaging tech that has already benefited the likes of AMD, Apple, and others. The Taiwanese foundry giant plans to do this through the formation of the 3DFabric Alliance, announced Thursday, which aims to help chip designers implement advanced packaging tech into their plans faster by collaborating with partner companies that are key to the development process.TSMC's partners cover several important elements of chip development, from electronic design automation and memory to substrates and testing. As part of the new alliance, they will have early access to TSMC's 3DFabric portfolio of 3D silicon stacking and advanced packaging technologies. The goal is to allow these partners to build new solutions in parallel with the development of TSMC's 3DFabric tech so that chip designers can get their hands on the tools, technologies, materials, and other resources necessary to make multi-die chip packages faster. TSMC's 3DFabric portfolio includes brand-new technology, like system-on-integrated-chips (SoIC), which underpins the 3D V-Cache tech in AMD's Milan-X and Ryzen 7 5800X3D processors that came out this year. The portfolio also includes older technologies: integrated-fan-out and chip-on-wafer-on-substrate (CoWoS), which have received new iterations over the past several years. Those using CoWoS include Nvidia and Amazon Web Services. Representatives from AMD, Nvidia, and AWS gave support for the new alliance, which is one of several set up by TSMC as part of its Open Innovation Platform initiative.TSMC veep of R&D, LC Lu, said while advanced packaging technologies can "open the door to a new era of chip-level and system-level innovation," "extensive ecosystem collaboration" is required to "help designers navigate the best path through the myriad options and approaches available to them.""Through the collective leadership of TSMC and our ecosystem partners, our 3DFabric Alliance offers customers an easy and flexible way to unlocking the power of 3D [integrated circuits] in their designs," he added.
AMD turned to advanced packaging to create chiplet designs and become a formidable CPU player again. Apple used the tech to beef up the power of its M1 Ultra chip. And Intel is pinning its future success on 2D and 3D multi-die packaging technologies as part of its ambitious comeback plan. Now TSMC, the world's largest contract chipmaker, wants to make chiplet-based products easier and faster to manufacture using its growing toolbox of advanced packaging tech that has already benefited the likes of AMD, Apple, and others. The Taiwanese foundry giant plans to do this through the formation of the 3DFabric Alliance, announced Thursday, which aims to help chip designers implement advanced packaging tech into their plans faster by collaborating with partner companies that are key to the development process.TSMC's partners cover several important elements of chip development, from electronic design automation and memory to substrates and testing. As part of the new alliance, they will have early access to TSMC's 3DFabric portfolio of 3D silicon stacking and advanced packaging technologies. The goal is to allow these partners to build new solutions in parallel with the development of TSMC's 3DFabric tech so that chip designers can get their hands on the tools, technologies, materials, and other resources necessary to make multi-die chip packages faster. TSMC's 3DFabric portfolio includes brand-new technology, like system-on-integrated-chips (SoIC), which underpins the 3D V-Cache tech in AMD's Milan-X and Ryzen 7 5800X3D processors that came out this year. The portfolio also includes older technologies: integrated-fan-out and chip-on-wafer-on-substrate (CoWoS), which have received new iterations over the past several years. Those using CoWoS include Nvidia and Amazon Web Services. Representatives from AMD, Nvidia, and AWS gave support for the new alliance, which is one of several set up by TSMC as part of its Open Innovation Platform initiative.
2% anual en moneda constante. Así que a contemporizar, que no pasa nada.Sds.
The Top 10 Countries for Moving Abroad 1. Canada 30 2. Japan 13 3. Spain 12 4. Germany 8 5. Qatar 6 6. Australia 5 7. Switzerland 4 8. Portugal 3 9. USA 210. UK 2
[...] En Bolsa se compran y venden cuotas de propiedad en 'Activos menos Pasivos' empresariales que, si se sobrevaloran, es porque se considera que habrá beneficios futuros —no decimos que la cotización «es» el descuento de beneficios futuros, sino que es el neto patrimonial más 'otra cosa', que incluye el descuento beneficios futuros, sí, pero también la imagen de marca, la cuota de mercado, etcétera. Es esencial al sistema capitalista que estas cuotas en universalidades productivas se compren y se venda, con los consiguientes riesgos. La Bolsa es la fiesta del capitalismo. [...]
Cita de: R.G.C.I.M. en Octubre 30, 2022, 13:16:06 pm2% anual en moneda constante. Así que a contemporizar, que no pasa nada.Sds.Claro que no. El que quiera moneda respaldada por oro... ya tiene el USD.